Fjelstad, Joseph: search on Z-Library

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1

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Benefits of reversing the circuit manufacturing and assembly processes for electronic products

Fjelstad, Joseph

Year:

2011

Language:

english

File:

PDF, 1018 KB

english, 2011

2

Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers

Fjelstad, Joseph, Karavakis, Konstantine, Haba, Belgacem

Journal:

Year:

1999

Language:

english

File:

PDF, 82 KB

english, 1999

3

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Past, present and future of electronic packaging

Fjelstad, Joseph

Year:

2010

Language:

english

File:

PDF, 107 KB

english, 2010

4

Flexible circuitry ‐ technology background and important fundamental issues

Fjelstad, Joseph

Journal:

Year:

1999

Language:

english

File:

PDF, 171 KB

english, 1999

5

Wafer level packaging of compliant, chip size ICs

Fjelstad, Joseph, DiStefano, Thomas, Faraci, Anthony

Journal:

Microelectronics International

Year:

2000

Language:

english

File:

PDF, 315 KB

english, 2000

6

3D PCB architecture for next generation high speed interconnections

Fjelstad, Joseph, Grundy, Kevin, Yasumura, Gary

Journal:

Year:

2005

Language:

english

File:

PDF, 533 KB

english, 2005

7

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - The importance of reliability in electronics

Fjelstad, Joseph

Year:

2010

Language:

english

File:

PDF, 96 KB

english, 2010

8

Interconnection strategies for high‐density printed circuits – an overview

Fjelstad, Joseph

Journal:

Year:

2002

Language:

english

File:

PDF, 373 KB

english, 2002

9

Environmentally friendly assembly of robust electronics without solder

Fjelstad, Joseph

Journal:

Year:

2008

Language:

english

File:

PDF, 378 KB

english, 2008

10

[IEEE 2009 10th International Symposium on Quality of Electronic Design (ISQED) - San Jose, CA, USA (2009.03.16-2009.03.18)] 2009 10th International Symposium on Quality of Electronic Design - Retrospective on electronics technology and prospective methods for co-design of IC packaging and manufacturing improvements

Fjelstad, Joseph

Year:

2009

Language:

english

File:

PDF, 2.15 MB

english, 2009

11

Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder

Fjelstad, Joseph

Journal:

Year:

2013

Language:

english

File:

PDF, 271 KB

english, 2013

12

Putting 3D interconnection technologies into perspective from chip to system

Fjelstad, Joseph

Journal:

Year:

2012

Language:

english

File:

PDF, 584 KB

english, 2012

13

[IEEE 2011 International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2011.03.14-2011.03.16)] 2011 12th International Symposium on Quality Electronic Design - Reliability — A highly important product attribute for the world's poorest consumers

Fjelstad, Joseph

Year:

2011

Language:

english

File:

PDF, 508 KB

english, 2011

14

Flexible circuit materials

Fjelstad, Joseph

Journal:

Year:

2008

Language:

english

File:

PDF, 185 KB

english, 2008

15

[IEEE 2015 IEEE Aerospace Conference - Big Sky, MT, USA (2015.3.7-2015.3.14)] 2015 IEEE Aerospace Conference - Advantages of using aluminum substrates for aerospace electronics

Fjelstad, Joseph

Year:

2015

Language:

english

File:

PDF, 1.68 MB

english, 2015

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